Product Description

The Precision CNC Copper Liquid Cooling Block for AI Servers is engineered for high-density compute platforms, targeting high-TDP Artificial Intelligence accelerators, GPUs, and multi-core server processors.

Machined from pure copper for maximum thermal conductivity, this liquid cold plate directly targets multi-hundred-watt to kilowatt-class compute modules. The internal flow architecture incorporates targeted skived or CNC-machined fin arrays directly over compute die hot spots, while peripheral copper wings absorb heat from VRMs (voltage regulator modules) and high-bandwidth memory (HBM) stacks.

Designed to fit within standardized 1U, 2U, and 4U rack-mount chassis, the block features low-profile blind-mate quick-disconnect (QD) fittings, robust EPDM/O-ring sealing boundaries, and high-accuracy mounting springs to ensure precise, calibrated mounting force on bare silicon.

TCH Thermal provides OEM build-to-print manufacturing for enterprise cloud providers, AI server ODMs, and liquid-cooling system integrators, manufacturing high-reliability copper cold plates from prototype validation to high-volume production.

Product Features

• Full-Coverage Multi-Zone Copper Baseplate: Simultaneously cools the main GPU/ASIC processor core, surrounding HBM memory modules, and high-current power stages (VRM/MOSFETs).

• Hot-Spot Targeted Fin Topologies: High-density internal fin zones are focused directly above the silicon compute dies to maximize cooling where heat flux peaks.

• Low-Profile 1U/2U Form Factor: Engineered to maintain strict Z-height envelopes, ensuring seamless fit within dense rack servers without blocking adjacent PCIe or OAM boards.

• Calibrated Spring-Screw Mounting Posts: Machined with precise stepped mounting standoffs that mate with captive spring hardware, ensuring uniform contact pressure without cracking fragile dies.

• Quick-Disconnect & Drip-Free Fitting Ready: Manifold ports are threaded to accept UQD (Universal Quick Disconnect) or custom manifold stub pipes compatible with rack-level liquid manifolds.

• Helium Leak-Tested Construction: Every production block undergoes strict pressure decay and helium leak testing to guarantee complete fluid containment inside data center environments.

Application of Precision CNC Copper Liquid Cooling Block for AI Servers

Specifically designed for hyperscale data centers, high-performance computing (HPC) clusters, and deep learning platforms.

• AI Training & Inference Servers

  • Multi-GPU server trays (8-GPU/16-GPU baseboards)

  • OAM (OCP Accelerator Module) cold plate assemblies

  • Custom ASIC neural network accelerator boards

  • High-density AI blade servers

• High-Performance Computing (HPC)

  • Supercomputing compute nodes

  • Direct-to-chip (D2C) liquid-cooled server racks

  • Clustered CPU/GPU scientific computing clusters

• Hyperscale Data Center Infrastructure

  • Modular edge AI compute enclosures

  • Retrofit liquid cooling conversion modules for enterprise server racks

  • Liquid-to-liquid CDU loop terminal assemblies

• Custom Server Hardware

  • Adaptable for bespoke compute nodes, edge telecom appliances, and specialized deep-learning acceleration hardware.

Advantages

• Optimized for Ultra-High TDP: Capable of dissipating >700W to 1000W+ thermal loads per socket, enabling processors to sustain peak boost clocks without thermal throttling.

• Prevents Data Center Drips: Robust multi-tier leak containment architecture and automated precision machining prevent joint fatigue over years of continuous uptime.

• High-Volume OEM Production Consistency: Multi-axis CNC production cells ensure tight dimensional repeatability from unit to unit, vital for large cluster deployments.

• Built to Customer CAD and Board Specs: Manufactured strictly around the customer's OAM/PCIe board layout, capacitor heights, and chassis plumbing constraints.

• Complete Direct-to-Chip Thermal Solution: Eliminates intermediate air resistance, dramatically lowering data center PUE (Power Usage Effectiveness).

Product Parameters

• Product Type: Direct-to-Chip (D2C) AI Server Water Block

• Target Hardware: AI Accelerators / GPUs / Multi-Core Server CPUs / HBM / VRM

• Base Material: High-Conductivity Copper (C1100 / OFC)

• Chassis Compatibility: Standard 1U, 2U, 4U, and OCP Rack Standards

• Thermal Dissipation: Up to 1000W+ per socket (design dependent)

• Internal Fin Structure: High-Density CNC-Milled / Skived Fin Array

• Fluid Connector Interface: Threaded G 1/4", UQD Quick Disconnects, or Brazed Copper Tubes

• Z-Height Envelope: Low-profile down to < 15 mm (customizable)

• Base Surface Finish: Anti-Oxidation Nickel Plating / Bare Fly-cut Copper

• Retention Mechanism: Custom backing plate / captive spring screws with controlled load

• Factory Testing: 100% Helium Leak Testing + Hydrostatic Pressure Testing (> 6 bar)

• Manufacturing Model: Build-to-Print OEM / ODM Contract Production

• Drawing Formats: 2D PDF/DWG, 3D STEP/IGES/x_t