FACTORY-DIRECT THERMAL SOLUTIONS
High-Performance Thermal Management Systems
Leverage our Engineering DNA for custom liquid cold plates and advanced heat sink manufacturing. From prototype development with Low MOQ flexibility to gigawatt-scale mass production.
24H DFM Feedback
100% Helium Leak Tested
China & Thailand Facilities
Explore Our Thermal Technologies
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Custom vacuum brazed, FSW, and embedded tube plates optimized for EV batteries and high-power electronics
Applications: EV Battery, IGBT, Data Center
Tech: Vacuum Brazing / FSW / Tube
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High fin density and thin profiles sliced directly from solid copper or aluminum blocks for seamless heat transfer
Applications: Telecom, UPS, High-Power Inverters
Material: Pure Copper / Aluminum
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High-speed precision stamped cooling components designed for cost-effective, high-volume electronics cooling
Applications: Board-level Components, Consumer Electronics.
Advantage: Ultra-low Cost for Mass Production.
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Standard and custom aluminum extruded profiles. The most widely used solution for general semiconductor thermal management.
Applications: LED Lighting, Industrial Power, CPU.
Capability: Custom CNC Post-Machining.
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Advanced integrated assemblies combining thermal plates, heat pipes, embedding blocks, and cooling fans.
Applications: High-TDP Servers, Telecommunications.
Integration: Multi-technology Thermal Assemblies.
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High-conductivity phase-change components including ultra-thin vapor chambers and sintered powder copper heat pipes.
Applications: Mobile Devices, Graphics Cards, CPU Nodes
Thermal Conductivity: $>5000W/m·K