2026-01-07
Heat sink assembly is a complete thermal management unit that dissipates heat from electronic components to ensure stable performance.
2026-01-07
Skived fin heat sink is a high-efficiency cooling solution with thin, closely spaced fins for rapid heat dissipation in electronics.
2025-12-31
High-Performance Thermal Solution for AI Servers, GPUs and High-Power Electronics
We have launched a Copper Tube Embedded Liquid Cold Plate for high-power thermal management in AI servers, GPUs, and power electronics. The design integrates embedded copper tubing to achieve high thermal conductivity, low thermal resistance, and stable coolant flow. With flexible customization and reliable manufacturing processes, it provides a scalable liquid cooling solution for power-dense computing systems and next-generation data centers.
2025-11-25
The Operation Principles of Loop Heat Pipes Explained
Loop heat pipes are innovative heat transfer devices that are widely used in various industries. They offer efficient and reliable thermal management solutions for electronics, aerospace, and other applications. Understanding the operation principles of loop heat pipes is crucial for optimizing their performance and ensuring their longevity.
2025-11-25
The Benefits of Using Sintered Powder Wicks in Heat Pipes
Sintered Powder Wicks in Heat Pipes are proven to enhance heat transfer efficiency by providing a larger surface area for heat exchange compared to other traditional wicking structures.
2025-11-25
The Importance of Thermal Management for High-Density Computing
In high-density computing environments, the heat generated by multiple servers and storage systems can quickly build up and cause performance issues. Efficient cooling systems are essential to maintain optimal temperatures and prevent overheating.