High-Performance Thermal Solution for AI Servers, GPUs and High-Power Electronics
We have launched a Copper Tube Embedded Liquid Cold Plate for high-power thermal management in AI servers, GPUs, and power electronics. The design integrates embedded copper tubing to achieve high thermal conductivity, low thermal resistance, and stable coolant flow. With flexible customization and reliable manufacturing processes, it provides a scalable liquid cooling solution for power-dense computing systems and next-generation data centers.
Copper Tube Embedded Liquid Cold Plate
1. Industry Background: Why Liquid Cooling Is No Longer Optional
As AI servers, high-density GPUs, and advanced computing platforms continue to push power densities beyond 500–1000 W per device, traditional air cooling solutions are reaching their physical limits.
Key industry trends driving liquid cooling adoption:
AI accelerators (e.g. NVIDIA H100 / B200 / GB300 platforms)
GPU power density exceeding 1.0 W/mm²
Server rack power climbing to 50–100 kW
Thermal throttling risks directly impacting performance and ROI
According to industry data, liquid cooling can reduce thermal resistance by 30–70% compared to conventional air-cooled heat sinks, while enabling higher compute density and lower energy consumption.
This has made liquid cold plates a core thermal component in next-generation data centers, AI clusters, and power electronics systems.

2. What Is a Copper Tube Embedded Liquid Cold Plate?
A Copper Tube Embedded Liquid Cold Plate is a liquid cooling solution where copper tubes are precisely embedded into an aluminum or copper base plate, forming an efficient internal coolant flow path.
Unlike machined microchannel cold plates, this structure offers:
Lower manufacturing complexity
Higher structural reliability
Better cost-performance balance for mid-to-high volume deployment
Typical Structure:
Base material: Aluminum or copper
Embedded tubing: Seamless copper tubes
Coolant: Water, glycol-water mixture, or dielectric fluids
Connection: Quick connectors, barbs, or custom fittings
3. Key Technical Advantages
3.1 Superior Heat Transfer Efficiency
Copper tubing provides:
Thermal conductivity ~390 W/m·K
Excellent heat spreading from hotspots
Stable performance under high flow rates
With optimized tube layout and contact interface, typical thermal resistance can reach:
≤ 0.05–0.12 °C/W, depending on flow rate and base material.
3.2 High Reliability Compared to Microchannels
Unlike microchannel cold plates:
No ultra-fine channels prone to clogging
Lower pressure drop
Better tolerance to coolant impurities
This makes copper tube embedded cold plates ideal for:
Long-term operation
Industrial and data center environments
Customers prioritizing reliability over extreme miniaturization
3.3 Flexible Design for Custom Applications
Copper tube embedded cold plates allow flexible customization in:
Tube diameter (Ø4–Ø10 mm common)
Tube routing (U-shape, serpentine, parallel)
Base plate thickness
Mounting hole patterns
Inlet/outlet positions
This adaptability makes them suitable for:
GPUs & accelerators
Power modules (IGBT / SiC / MOSFET)
AI server CPUs
Battery energy storage systems (BESS)

4. Manufacturing Process: From Concept to Mass Production
Step 1: Thermal Simulation & Flow Design
CFD thermal simulation
Hotspot analysis
Pressure drop optimization
Flow uniformity verification
Step 2: Precision Machining
CNC machining of tube grooves
Tight flatness control (≤ 0.05 mm)
Surface roughness optimization
Step 3: Copper Tube Embedding
Tube press-fitting or brazing
Controlled contact pressure
Ensuring minimal thermal interface resistance
Step 4: Brazing / Bonding
Vacuum brazing or controlled atmosphere brazing
Leak prevention and structural reinforcement
Step 5: Leak Testing & Quality Control
Helium leak testing
Pressure testing (typically 1.5–2× operating pressure)
Thermal performance validation

5. Typical Performance Metrics
| Parameter | Typical Value |
|---|---|
| Heat load capacity | 300–1200 W |
| Thermal resistance | 0.05–0.12 °C/W |
| Flow rate | 0.5–3.0 L/min |
| Pressure drop | < 30 kPa |
| Operating temperature | -20°C to 80°C |
| Coolant compatibility | Water / Glycol |
6. Customer Pain Points We Solve
❌ Problem 1: Air Cooling Cannot Meet AI Thermal Loads
➡ Solution: Liquid cold plate increases heat transfer efficiency by up to 70%
❌ Problem 2: Microchannel Plates Are Too Costly or Risky
➡ Solution: Embedded copper tube design balances performance and reliability
❌ Problem 3: Standard Cold Plates Do Not Fit Custom Hardware
➡ Solution: Full mechanical and thermal customization
❌ Problem 4: Long Lead Time for New Designs
➡ Solution: In-house CNC, tube forming, and brazing capabilities shorten development cycles
7. What We Can Do for Our Customers
We are not just a cold plate manufacturer — we are a thermal solution partner.
Our Capabilities Include:
Thermal simulation & design optimization
Custom cold plate development
Prototype to mass production scaling
Multi-factory manufacturing support
Integration with full liquid cooling systems
Industries We Serve:
AI servers & data centers
GPU & accelerator manufacturers
Power electronics
Energy storage systems
Industrial automation
8. Conclusion: A Practical Liquid Cooling Solution for High-Power Applications
The Copper Tube Embedded Liquid Cold Plate offers a proven, scalable, and cost-effective liquid cooling solution for modern high-power electronics.
It bridges the gap between:
High-performance thermal demands
Manufacturing feasibility
Long-term reliability
As AI computing and high-density electronics continue to evolve, this solution provides a solid thermal foundation for future-ready systems.
Related news
2025-11-25
Message
If you are interested in our products, welcome to leave a message, we will contact you as soon as possible!


