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High-Performance Thermal Solution for AI Servers, GPUs and High-Power Electronics

We have launched a Copper Tube Embedded Liquid Cold Plate for high-power thermal management in AI servers, GPUs, and power electronics. The design integrates embedded copper tubing to achieve high thermal conductivity, low thermal resistance, and stable coolant flow. With flexible customization and reliable manufacturing processes, it provides a scalable liquid cooling solution for power-dense computing systems and next-generation data centers.


Copper Tube Embedded Liquid Cold Plate


1. Industry Background: Why Liquid Cooling Is No Longer Optional

As AI servers, high-density GPUs, and advanced computing platforms continue to push power densities beyond 500–1000 W per device, traditional air cooling solutions are reaching their physical limits.

Key industry trends driving liquid cooling adoption:

AI accelerators (e.g. NVIDIA H100 / B200 / GB300 platforms)

GPU power density exceeding 1.0 W/mm²

Server rack power climbing to 50–100 kW

Thermal throttling risks directly impacting performance and ROI

According to industry data, liquid cooling can reduce thermal resistance by 30–70% compared to conventional air-cooled heat sinks, while enabling higher compute density and lower energy consumption.

This has made liquid cold plates a core thermal component in next-generation data centers, AI clusters, and power electronics systems.


2. What Is a Copper Tube Embedded Liquid Cold Plate?

A Copper Tube Embedded Liquid Cold Plate is a liquid cooling solution where copper tubes are precisely embedded into an aluminum or copper base plate, forming an efficient internal coolant flow path.

Unlike machined microchannel cold plates, this structure offers:

Lower manufacturing complexity

Higher structural reliability

Better cost-performance balance for mid-to-high volume deployment

Typical Structure:

Base material: Aluminum or copper

Embedded tubing: Seamless copper tubes

Coolant: Water, glycol-water mixture, or dielectric fluids

Connection: Quick connectors, barbs, or custom fittings


3. Key Technical Advantages

3.1 Superior Heat Transfer Efficiency

Copper tubing provides:

Thermal conductivity ~390 W/m·K

Excellent heat spreading from hotspots

Stable performance under high flow rates

With optimized tube layout and contact interface, typical thermal resistance can reach:

≤ 0.05–0.12 °C/W, depending on flow rate and base material.


3.2 High Reliability Compared to Microchannels

Unlike microchannel cold plates:

No ultra-fine channels prone to clogging

Lower pressure drop

Better tolerance to coolant impurities

This makes copper tube embedded cold plates ideal for:

Long-term operation

Industrial and data center environments

Customers prioritizing reliability over extreme miniaturization


3.3 Flexible Design for Custom Applications

Copper tube embedded cold plates allow flexible customization in:

Tube diameter (Ø4–Ø10 mm common)

Tube routing (U-shape, serpentine, parallel)

Base plate thickness

Mounting hole patterns

Inlet/outlet positions

This adaptability makes them suitable for:

GPUs & accelerators

Power modules (IGBT / SiC / MOSFET)

AI server CPUs

Battery energy storage systems (BESS)


4. Manufacturing Process: From Concept to Mass Production

Step 1: Thermal Simulation & Flow Design

CFD thermal simulation

Hotspot analysis

Pressure drop optimization

Flow uniformity verification

Step 2: Precision Machining

CNC machining of tube grooves

Tight flatness control (≤ 0.05 mm)

Surface roughness optimization

Step 3: Copper Tube Embedding

Tube press-fitting or brazing

Controlled contact pressure

Ensuring minimal thermal interface resistance

Step 4: Brazing / Bonding

Vacuum brazing or controlled atmosphere brazing

Leak prevention and structural reinforcement

Step 5: Leak Testing & Quality Control

Helium leak testing

Pressure testing (typically 1.5–2× operating pressure)

Thermal performance validation


5. Typical Performance Metrics

ParameterTypical Value
Heat load capacity300–1200 W
Thermal resistance0.05–0.12 °C/W
Flow rate0.5–3.0 L/min
Pressure drop< 30 kPa
Operating temperature-20°C to 80°C
Coolant compatibilityWater / Glycol

6. Customer Pain Points We Solve

❌ Problem 1: Air Cooling Cannot Meet AI Thermal Loads

➡ Solution: Liquid cold plate increases heat transfer efficiency by up to 70%

❌ Problem 2: Microchannel Plates Are Too Costly or Risky

➡ Solution: Embedded copper tube design balances performance and reliability

❌ Problem 3: Standard Cold Plates Do Not Fit Custom Hardware

➡ Solution: Full mechanical and thermal customization

❌ Problem 4: Long Lead Time for New Designs

➡ Solution: In-house CNC, tube forming, and brazing capabilities shorten development cycles


7. What We Can Do for Our Customers

We are not just a cold plate manufacturer — we are a thermal solution partner.

Our Capabilities Include:

Thermal simulation & design optimization

Custom cold plate development

Prototype to mass production scaling

Multi-factory manufacturing support

Integration with full liquid cooling systems

Industries We Serve:

AI servers & data centers

GPU & accelerator manufacturers

Power electronics

Energy storage systems

Industrial automation


8. Conclusion: A Practical Liquid Cooling Solution for High-Power Applications

The Copper Tube Embedded Liquid Cold Plate offers a proven, scalable, and cost-effective liquid cooling solution for modern high-power electronics.

It bridges the gap between:

High-performance thermal demands

Manufacturing feasibility

Long-term reliability

As AI computing and high-density electronics continue to evolve, this solution provides a solid thermal foundation for future-ready systems.

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