Product Description

Engineered to meet the thermal demands of next-generation artificial intelligence workloads, the Custom CNC Precision Copper AI Server Water Block delivers high-efficiency liquid cooling for high-density compute environments. Fabricated from ultra-pure oxygen-free copper using high-precision multi-axis CNC machining, this cold plate features ultra-dense micro-channel fin arrays designed to minimize thermal resistance across massive GPU, CPU, and custom ASIC dies.

Tailored for modern 1U to 4U rack-mount servers, modular supercomputing clusters, and edge AI deployments, each unit is built to withstand continuous, high-pressure liquid circulation. With corrosion-resistant surface finishing, robust EPDM/FKM sealing, and customizable port layouts, it provides enterprise data centers with an optimal balance of thermal dissipation, reliability, and form-factor efficiency.

Product Features

• High-Purity Copper Cold Plate: Machined from premium C11000/oxygen-free copper (OFC) to deliver thermal conductivity exceeding 390 W/(m·K).

• Precision Micro-Channel Fins: Sub-millimeter skived or CNC-milled micro-fin arrays (fin width/gap down to 0.15–0.2 mm) maximize liquid-to-copper contact surface area while maintaining low hydraulic impedance.

• Full-Coverage Multi-Zone Cooling: Optimized flow architecture engineered to dissipate heat simultaneously from the central processor (GPU/TPU/CPU), high-bandwidth memory (HBM3/HBM3e), and high-power voltage regulator modules (VRMs).

• Leak-Proof Architecture: Features recessed industrial O-ring seals (EPDM or Fluorosilicone) and helium/pressure leak-testing protocols rated for long-term data center deployment.

• Low-Profile Form Factor: Designed to fit standard 1U, 2U, and open-rack architectures (OCP ORv3 compatible) without interfering with adjacent PCIe expansion cards or power distribution busbars.

• Corrosion-Resistant Surface Treatment: Available with electroless nickel plating to prevent galvanic corrosion, oxidation, and erosion from industrial coolants.

Applications

• AI Training & Inference Accelerators: Custom cooling for high-TDP accelerator boards (such as NVIDIA HGX/H100/H200/B200, AMD Instinct MI300 series, and Google TPU clusters).

• High-Performance Computing (HPC): Supercomputing nodes, computational fluid dynamics (CFD) clusters, and financial algorithmic modeling engines running sustained multi-kilowatt rack loads.

• Hyperscale Cloud Data Centers: Retrofit and greenfield direct-to-chip (D2C) liquid-cooled infrastructure aimed at reducing operational Power Usage Effectiveness (PUE).

• Edge AI Servers: Ruggedized, high-density AI inference systems operating in space-constrained industrial or telecom environments.

• Custom ASIC & FPGA Racks: Specialized crypto-mining, rendering farms, and signal-processing blades requiring application-specific cold-plate geometry.

Advantages

• Superior Thermal Dissipation: Eliminates thermal throttling under sustained peak AI computation, allowing processors to maintain maximum clock speeds and continuous boost performance.

• Energy Cost Optimization: Enables facilities to run higher coolant inlet temperatures (up to 40°C–45°C), drastically lowering chiller power consumption and pushing facility PUE below 1.15.

• Bespoke Engineering Flexibility: Complete customization of mounting bracket patterns, port orientations (G1/4", quick-disconnect couplings, barb fittings), and baseplate dimensions to match proprietary PCB layouts.

• Long-Term Operational Reliability: Industrial-grade metallurgy and automated helium mass spectrometry testing prevent micro-leakage risks inside critical compute hardware.

• Optimized Hydraulic Balance: Low pressure-drop internal routing allows servers to be connected in parallel or series loops without overloading central server rack pumping units (CDUs).

Product Parameters