Product Description

The Custom Liquid Cooling Block for AI Chips is engineered for direct-to-die (D2D) and direct-lid contact cooling, specifically designed to extract extreme heat fluxes from high-power artificial intelligence processors, neural network accelerators, and deep-learning ASICs.

Manufactured via high-precision CNC machining from high-purity copper, this cold plate eliminates intermediate thermal interface bottlenecks by making direct, intimate contact with the bare silicon die or integrated heat spreader (IHS). The internal chamber features fine-pitch micro-structures optimized for jet impingement or balanced split-flow dynamics, driving coolant straight over localized high-heat computational cores and adjacent High Bandwidth Memory (HBM3/HBM3e) stacks.

To ensure reliable long-term deployment in mission-critical AI clusters, the block incorporates stepped mounting standoffs that deliver precise, calibrated contact pressure across the fragile silicon package without risk of cracking. Coolant routing, low-profile quick-disconnect (QD) fittings, and perimeter component relief pockets are custom-tailored to the customer's specific carrier board geometry.

TCH Thermal provides build-to-print OEM contract manufacturing, thermal prototype machining, and scalable mass production of direct-contact AI chip water blocks based on customer CAD models, thermal envelope targets, and engineering drawings.

Product Features

• Direct-Contact Die Interface: Contact pedestals are fly-cut or precision-lapped to achieve ultra-tight planarity and mirror-like surface roughness (Ra < 0.2 um), minimizing bond line thickness with direct thermal interface materials (TIM).

• Direct-to-Core Jet Impingement Architecture: Coolant can be directed straight at localized silicon hotspots via targeted jet manifolds, rapidly suppressing sudden thermal spikes during intense training workloads.

• Co-Packaged HBM & Die Step Matching: Multi-height baseplate milling accommodates coplanar variations between the primary computing logic die and co-packaged HBM stacks.

• Calibrated Die-Protection Clamping: Engineered with precise standoff heights to mate with controlled-load spring fasteners, maintaining stable mechanical pressure without damaging delicate silicon.

• Hermetic Vacuum Brazed / EPDM Sealing: Fluid paths are permanently sealed via fluxless vacuum brazing or multi-barrier O-ring grooves to guarantee zero leakage inside expensive accelerator trays.

• Build-to-Print OEM Customization: Machined strictly to customer 3D models, providing clearance pockets for surrounding SMD capacitors, inductors, and socket frames.

Application of Custom Liquid Cooling Block for AI Chips

Engineered for direct-to-chip (D2C) liquid cooling deployments across dense computing platforms and high-stress test benches:

• AI Training & Inference Accelerators

  • Custom neural network ASICs (TPUs, NPUs)

  • High-TDP GPU accelerator modules (OAM form factor)

  • Multi-die package architectures (System-on-Wafer / Chiplet designs)

  • High-bandwidth inference mezzanine cards

• Hyperscale AI Data Centers

  • Direct-to-die liquid-cooled compute blades

  • High-density 1U/2U AI server trays

  • Liquid-cooled supercomputing clusters (HPC)

  • Immersion-to-direct liquid conversion architectures

• AI Silicon Validation & Lab Characterization

  • First-silicon power-on test fixtures

  • Post-silicon thermal margin validation benches

  • High-wattage automated burn-in sockets

• OEM Hardware Platforms

  • Proprietary AI hardware assemblies where standard off-the-shelf cold plates cannot match unique die heights, socket footprints, or flow-rate limits.

Advantages

• Elimination of Intermediate Thermal Resistance: Direct-to-die/direct-lid cooling bypasses standard thermal bottlenecks, keeping compute junctions far below thermal-throttling thresholds.

• Protection for Fragile Silicon Packages: High-accuracy CNC datum control and engineered spring-load geometry prevent uneven mechanical stress on bare dies.

• Consistent Flow Distribution Over Hotspots: Precision-machined micro-fin channels ensure uniform coolant flow across both the compute core and memory tiles.

• Helium-Tight Data Center Safety: 100% helium mass-spectrometer testing guarantees leak rates below critical data-center safety standards.

• Flexible OEM Prototyping to Volume: Fast-turn CNC sample production facilitates rapid silicon evaluation cycles prior to full-scale cluster manufacturing.

Product Parameters

• Product Type: Direct-Contact AI Chip Water Block (Direct-to-Die / Direct-Lid)

• Target Hardware: AI ASICs / NPUs / GPUs / Multi-Die Chiplet Packages / HBM

• Base Material: High-Purity Oxygen-Free Copper (C10200 / C11000)

• Heat Dissipation Rating: 500W to 1200W+ per package (design dependent)

• Base Surface Finish: Precision Fly-Cut / Lapped (Ra 0.2 - 0.4 um)

• Surface Flatness: <= 0.015 mm across active silicon zone

• Internal Core Geometry: High-Density Micro-Fins / Micro-Channels / Jet Impingement

• Port / Fitting Type: G 1/4" Threaded, UQD Quick Disconnects, or Brazed Tubing Stubs

• Sealing Method: Vacuum Brazing / High-Performance Fluoropolymer O-Ring

• Operating Pressure: Rated up to 6 bar standard (higher proof available)

• Leak Detection Standard: 100% Helium Mass Spectrometer Testing (< 1x10^-9 mbar*l/s)

• Plating Options: Bare Copper / Anti-Oxidation Electroless Nickel Plating

• Manufacturing Scope: Build-to-Print OEM / ODM Contract Production

• File Formats Supported: STEP, IGES, Parasolid (x_t), SolidWorks, 2D PDF