Introduction to Skived Heat Sinks
A skived heat sink is a type of heat sink that is manufactured through a process called skiving. Heat sinks are devices used to dissipate heat from electronic components to prevent overheating, which may cause damage or failure of the component. Skiving is a machining process that involves removing material in layers using a specially designed tool, resulting in a thin-finned, lightweight heat sink with excellent thermal conductivity.
Advantages of Skived Heat Sinks
Skived heat sinks offer several advantages over other types of heat sinks. Firstly, because they are machined from a single piece of material, they have better thermal performance compared to bonded or pressed heat sinks. They also have a high aspect ratio, meaning they can handle higher heat loads than other types of heat sinks. Additionally, skived heat sinks are light in weight, making them ideal for portable electronic devices that require thermal management without increasing weight.
Skiving Process
The skiving process involves removing material from a metal plate or block using a specially designed skiving tool. The tool has multiple blades that skive the material from the metal plate in thin layers, creating the thin fins that make up the heat sink. The fins can be customized in terms of height, thickness, and spacing to achieve the desired thermal performance. The skiving process can be performed on various materials such as aluminum, copper, and alloys, depending on the application.
Types of Skived Heat Sinks
There are two main types of skived heat sinks: straight fin and cross-cut fin. Straight fin skived heat sinks have fins that run straight across the length of the heat sink, while cross-cut fin skived heat sinks have fins that are cut at an angle. Cross-cut fin skived heat sinks offer better thermal performance due to a larger surface area for heat dissipation. However, they are more difficult to manufacture and therefore more expensive than straight fin skived heat sinks.
Applications of Skived Heat Sinks
Skived heat sinks are commonly used in various electronic devices such as computers, smartphones, LED lighting, and power supplies. They are also used in industrial and automotive applications, where heat dissipation is critical for optimal performance and reliability. Skived heat sinks can be further customized with additional features such as thermal tapes, mounting holes, and changeable fins to cater to specific applications.
Factors to Consider when Choosing a Skived Heat Sink
When choosing a skived heat sink, the following factors should be considered:
- Thermal performance
- Physical dimensions
- Material compatibility
- Environmental conditions
- Cost
Recent Advances in Skived Heat Sinks
In recent years, there have been several advances in skived heat sinks technology, including the development of hybrid skived and extruded heat sinks. These heat sinks combine the benefits of both skiving and extrusion to create high-performance heat sinks with improved manufacturing efficiency. Other advances include the use of advanced materials such as graphene and carbon nanotubes in heat sink manufacturing, which offer superior thermal performance and durability.
Maintenance of Skived Heat Sinks
Proper maintenance of skived heat sinks is essential to ensure optimal performance and maximum lifespan. Regular cleaning of the heat sink using compressed air can help remove any dust or debris that may obstruct airflow. If the heat sink is attached to a fan, the fan should also be cleaned to prevent any dust buildup that could affect its performance. It is also important to ensure that the thermal interface material (TIM) between the heat sink and the component is replaced periodically to maintain good thermal contact.
Conclusion
Skived heat sinks are an effective thermal management solution for electronic devices, offering excellent thermal performance, lightweight design, and customizability. With recent advances in technology, skived heat sinks are becoming more efficient and cost-effective, helping to meet the increasing demand for thermal management in electronic devices.